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Guild: wafer.space Community
Channel: ℹ️ - Information / general / Ideas for different size silicon area.
After: 2025-07-31 11:59 p.m.
Before: 2025-09-01 12:00 a.m.
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[2025-08-21 8:02 p.m.] mithro_



[2025-08-21 8:02 p.m.] mithro_
To be a little clearer;
 * (a) Eventually I hope that I can support any die size and use something like laser dicing. For now that is an added complexity / risk it doesn't make sense to take on (kinda like the gf180mcu process optimization idea that I abandoned).

 * (b) In the shorter term, given that you get back bare die by default, I believe there could be a few options for post processing to split them into even smaller units.


[2025-08-21 8:04 p.m.] mithro_
At the moment it is $7 USD per die -- so if we could divide the die into 8 parts, that would make it under $1 per die.


[2025-08-21 8:05 p.m.] mithro_
Given that 3 * BOM cost;
 * $7 USD per die really means a >$100 USD product.
 * $1 USD per die means that <$30 USD or even $10 USD type products become viable.


[2025-08-21 8:05 p.m.] 246tnt
Ok, I wasn't really sure that dicing "a second time" was something doable at all at scale ...


[2025-08-21 8:07 p.m.] mithro_
@tnt - "scale" is a relative term, ~1,000 units it pretty small for PCBA and non-existant scale for semiconductor people.


[2025-08-21 8:13 p.m.] mithro_
Actually, if it's $7 USD per die and you want $1 USD per sub-die, then you can spend ~$1 USD per die to do the dicing.


[2025-08-21 8:16 p.m.] 246tnt
By scale I meant, not 10 units done by hand.
Because if you get the die in a gel pack like we dit from the skywater runs, I'm not sure how you put them in a laser dicing machine "in bulk" since the ones I've seen take full wafers ...


[2025-08-21 8:18 p.m.] 246tnt
But it's not like I have tons of experience with dicing so it's very possible there is a way 🤷


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